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device performance specification revision 11 mtd/ps-0502 october 17, 2006 kodak kai-1010 kai-1011 image sensor 1008 (h) x 1018 (v) interline transf er progressive scan ccd
contents summary specification ............................................................................................................................................................... 4 description ..................................................................................................................................................................................4 features .......................................................................................................................................................................................4 applications .................................................................................................................................................................................4 ordering information .................................................................................................................................................................. 5 device description ...................................................................................................................................................................... 6 architecture .................................................................................................................................................................................6 image acquisition ........................................................................................................................................................................7 charge transport ........................................................................................................................................................................7 output structure ..........................................................................................................................................................................8 electronic shutter .......................................................................................................................................................................9 color filter array (optiona l, for kai-1011-cba only) .................................................................................................................9 physical description ............................................................................................................................... ...................................10 pin description and device orientation ............................................................................................................................... .10 imaging performance ............................................................................................................................... ................................ 11 electro-optical for kai-1011-cba ............................................................................................................................... .............11 electro-optical for kai-1010-aba ............................................................................................................................... .............13 ccd image specifications ............................................................................................................................... ..........................16 output amplifier @ vdd = 15v, vss = 0.0v ............................................................................................................................... 16 general ............................................................................................................................... .......................................................17 operation ............................................................................................................................... .................................................... 20 absolute maximum range ............................................................................................................................... .........................20 dc operating conditions ............................................................................................................................... ............................21 ac clock level conditions ............................................................................................................................... .........................22 ac timing requirements for 20 mhz operation ......................................................................................................................23 frame timing - single register readout .............................................................................................................................24 line timing - single register readout ............................................................................................................................... .25 pixel timing - single register readout ............................................................................................................................... 26 electronic shutter timing - single register readout .........................................................................................................27 frame timing - dual register readout ............................................................................................................................... 28 line timing - dual register readout ............................................................................................................................... ....29 pixel timing - dual register readout ............................................................................................................................... ...30 fast dump timing ? removing four lines ..........................................................................................................................31 binning ? two to one line binning ............................................................................................................................... ........32 timing ? sample video waveform ............................................................................................................................... .........33 storage and handling ............................................................................................................................... ................................ 34 climatic requirements ............................................................................................................................... ..............................34 esd ............................................................................................................................................................................................34 cover glass care and cleanliness ............................................................................................................................... ............34 environmental exposure ............................................................................................................................... ............................34 mechanical information ............................................................................................................................... ............................. 35 completed assembly ............................................................................................................................... .................................35 cover glass ............................................................................................................................... .................................................37 quality assurance and reliability ............................................................................................................................... .............. 38 quality strategy ............................................................................................................................... ..........................................38 replacement ............................................................................................................................... ..............................................38 liability of the supplier ............................................................................................................................... ..............................38 liability of the customer ............................................................................................................................... ............................38 ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p2
reliability ............................................................................................................................... ....................................................38 test data retention ............................................................................................................................... ....................................38 mechanical ............................................................................................................................... ..................................................38 life support applications policy ............................................................................................................................... ................ 38 revision changes ............................................................................................................................... ....................................... 39 figures figure 1 functional block diagram ...............................................................................................................................................6 figure 2 true 2 phase ccd cross section ....................................................................................................................................7 figure 3 output structure ...............................................................................................................................................................8 figure 4 cfa pattern ......................................................................................................................................................................9 figure 5: pinout diagram ............................................................................................................................... ..............................10 figure 6 nominal kai-1011-cba spectral response .................................................................................................................12 figure 7 nominal kai-1010-aba spectral response .................................................................................................................13 figure 8 angular dependence of quantum efficiency .................................................................................................................14 figure 9 frame rate versus horizontal clock frequency ..........................................................................................................15 figure 10 typical kai-1010-aba photoresponse ........................................................................................................................17 figure 11 example of vsat versus vsub ............................................................................................................................... ........18 figure 12 recommended output structure load diagram ........................................................................................................21 figure 13 frame timing - single register readout ....................................................................................................................24 figure 14 line timing - single register output ..........................................................................................................................25 figure 15 pixel timing diagra m - single register readout .......................................................................................................26 figure 16 electronic shutter timing diagram - single register readout .................................................................................27 figure 17 frame timing - dual register readout ......................................................................................................................28 figure 18 line timing - dual register output .............................................................................................................................29 figure 19 figure pixel timing diagram - dual register readout .............................................................................................30 figure 20 fast dump timing - removing four lines .................................................................................................................31 figure 21 binning - 2 to 1 line binning ............................................................................................................................... ........32 figure 22 sample video waveform at 5mhz ............................................................................................................................... .33 figure 23: completed assembly (1 of 2) ............................................................................................................................... .......35 figure 24: completed assembly (2 of 2) ............................................................................................................................... .......36 figure 25: glass drawing ............................................................................................................................... ..............................37 tables table 1 electro-optical imag e specifications kai-1011-cba .....................................................................................................11 table 2 electro-optical imag e specifications kai-1010-aba .....................................................................................................13 table 3 ccd image specifications ............................................................................................................................... ................16 table 4 output amplifier image specifications ...........................................................................................................................16 table 5 general image specifications ............................................................................................................................... ...........17 table 6 absolute maximum ranges ............................................................................................................................... ..............20 table 7 dc operating conditions ............................................................................................................................... ..................21 table 8 ac clock level conditions ............................................................................................................................... ................22 table 9 ac timing requirem ents for 20 mhz operation ............................................................................................................23 table 10 climatic requirements ............................................................................................................................... ...................34 ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p3
summary specification kodak kai-1010 image sensor 1008 (h) x 1018 (v) progressive scan interline ccd image sensor description the kodak kai-1010 image sensor is a high-resolution monochrome charge coupled device (ccd) device whose non-interlaced architecture makes it ideally suited for video, electronic still and motion/still camera applications. the device is bu ilt using an advanced true two-phase, double-polysilicon, nmos ccd technology. the p+npn- photodetector el ements eliminate image lag and reduce image smear while providing antiblooming protection and electronic-exposure control. the total chip size is 10.15 (h) mm x 10.00 (v) mm. features ? front illuminated interline architecture ? progressive scan (non-interlaced) ? electronic shutter ? integral rgb color filter array (optional) ? on-chip dark reference pixels ? low dark current ? high sensitivity output structure ? dual output shift registers ? antiblooming protection ? negligible lag ? low smear (0.01% with microlens) applications ? industrial imaging parameter typical value architecture interline ccd, non-interlaced total number of pixels 1024 (h) x 1024 (v) number of effective pixels 1008 (h) x 1018 (v) number of active pixels 1008 (h) x 1018 (v) number of outputs 1 or 2 pixel size 9 m (h) x 9 m (v) active image size 9.1 mm (h) x 9.2 mm (v) 12.9 mm (diagonal) optical fill-factor 60% saturation signal >50,000 electrons output sensitivity 12 v/electron dark noise 50 electrons rms dark current <0.5 na/cm 2 quantum efficiency (wavelength = 450, 530, 650 nm) 20%, 25%, 22% blooming suppression >100 x maximum data rate 20 mh z/channel (2 channels) image lag negligible package cerdip cover glass ar coated (both sides) ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p4
ordering information catalog number product name descrip tion marking code 2h4615 kai- 1010-aaa-cr-ba monochrome, no microlens, cerdip packag e (sidebrazed), taped clear cover glass with ar coating (2 sides), standard grade kai-1010 serial number 2h4115 kai- 1010-aba-cd-ae monochrome, telecentric microlens, cerdip package (sidebrazed), clear cover glass with ar coating (both sides), engineering sample kai-1010m serial number 2h4614 kai- 1010-aba-cd-ba monochrome, telecentric microlens, cerdip package (sidebrazed), clear cover glass with ar coating (both sides), standard grade kai-1010m serial number 2h4121 kai- 1010-aba-cr-ae monochrome, telecentric microlens, cerdip package (sidebrazed), taped clear cover glass with ar coating (2 sides), engineering sample kai-1010m serial number 2h4613 kai- 1010-aba-cr-ba monochrome, telecentric microlens, cerdip package (sidebrazed), taped clear cover glass with ar coating (2 sides), standard grade kai-1010m serial number 4h0276 kai- 1011-cba-cd-ae color (bayer rgb), telecentric microlens, cerdip package (sidebrazed), clear cover glass with ar coating (bot h sides), engineering sample kai-1011cm serial number 4h0275 kai- 1011-cba-cd-ba color (bayer rgb), telecentric microlens, cerdip package (sidebrazed), clear cover glass with ar coating (b oth sides), standard grade kai-1011cm serial number 4h0060 kek-4h0060-kai- 1010/1011-12-20 evaluation board (complete kit) n/a please see the user?s manual (mtd/ps-0867) for information on the evaluation kit for this part. please see iss application note ?product naming convention? (mtd/ps-0892) for a full description of naming convention used for kodak image sensors. address all inquiries an d purchase orders to: image sensor solutions eastman kodak company rochester, new york 14650-2010 phone: (585) 722-4385 fax: (585) 477-4947 e-mail: imagers@kodak.com ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p5
device description architecture 4 dark lines at bottom of image 2 dark lines at top of image 6 dark columns 10 dark columns kai-1010 active image area: 1008 (h) x 1018 (v) 9.0 x9.0 m 2 pixels horizontal register a 6 dummies 2 dummies figure 1 function al block diagram the kai-1010 consists of 1024 x 1024 photodiodes, 1024 vertical (parallel) ccd shif t registers (vccds), and dual 1032 pixel horizontal (serial) ccd shift registers (hccds) with independent output structures. the device can be operated in either single or dual line mode. the advanced, progressive-scan architecture of the device allows the entire image area to be read out in a single scan. the active pixels are arranged in a 1008 (h) x 1018 (v) array with an additional 16 columns and 6 rows of light-shielded dark reference pixels. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p6
image acquisition an electronic representation of an image is formed when incident photons falling on the sensor plane create electron-hole pairs within the individual silicon photodiodes. these photoelectrons are collected locally by the formation of potential wells at each photosite. below photodiode saturation, the number of photoelectrons collected at each pixel is linearly dependent on light level and exposure time and non- linearly dependent on wavelength. when the photodiode's charge capacity is reached, excess electrons are discharged into the substrate to prevent blooming. charge transport the accumulated or integrated charge from each photodiode is transported to the output by a three step process. the charge is first transported from the photodiodes to the vccds by applying a large positive voltage to the phase-one vertical clock (?v1). this reads out every row, or line, of photodiodes into the vccds. the charge is then transpor ted from the vccds to the hccds line by line. finally , the hccds transport these rows of charge packets to the output structures pixel by pixel. on each falling edge of the horizontal clock, ?h2, these charge packets are dumped over the output gate (og, figure 3 ) onto the floating di ffusion (fda and fdb, figure 3 ). both the horizontal and vertical shift registers use traditional two-phase complementary clocking for charge transport. transfer to the hccds begins when ?v2 is clocked high and then low (while holding ?h1a high) causing charge to be transferred from ?v1 to ?v2 and subsequently into the a hccd. the a register can now be read out in single line mode. if it is desired to operate the device in a dual line readout mode for higher frame rates, this line is tr ansferred into the b hccd by clocking ?h1a to a low state, and ?h1b to a high state while holding ?h2 low. after ?h1a is returned to a high state, the next line can be transferred into the a hccd. after this clocking sequence, both hccds are read out in parallel. the charge capacity of the horizontal ccds is slightly more than twice that of the vertical ccds. this feature allows the user to perform two-to-one line aggregation in the charge domain during v-to-h transfer. this device is also equipped with a fast dump feature that allows the user to selectively dump complete lines (or rows) of pixels at a time. this dump, or line clear, is also accomplished during the v-to-h transfer time by clocking the fast dump gate. pixel pn+1 pixel pn figure 2 true 2 phase ccd cross section direction of transfer -v +v -v +v q1 q2 ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p7
output structure charge packets contained in the horizontal register are dumped pixel by pixel, onto the floating diffusion output node whose potential varies li nearly with the quantity of charge in each packet. the amount of potential change is determined by the expression vfd= q/cfd. a three stage source-follower amplifier is used to buffer this signal voltage off chip with slightly less than unity gain. the translation from the charge domain to the voltage domain is quantified by the output sensitivity or charge to voltage conversion in terms of v/e - . after the signal has been sampled off-chip, the reset clock (?r) removes the charge from the floating diffusion and resets its potential to the reset-drain voltage (vrd). figure 3 output structure vdd vo ut a vss & o g vo ut b hc c da hc c db rd r vwell vsub fdb (n / c ) fda (n / c ) ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p8
electronic shutter the kai-1010 provides a stru cture for the prevention of blooming which may be used to realize a variable exposure time as well as performing the anti-blooming function. the anti-blooming function limits the charge capacity of the photodiode by draining excess electrons vertically into the substrate (hence the name vertical overflow drain or vod) . this function is controlled by applying a large potential to the device substrate (device terminal sub). if a sufficiently large voltage pulse (ves 40v) is applied to the substr ate, all photodiodes will be emptied of charge through the substrate, beginning the integration period. after returning the substrate voltage to the nominal value, charge can accumulate in the diodes and the charge packet is subsequently readout onto the vccd at the next occurrence of the high level on v1. the integration time is then the time between the falling edges of the substrate shutter pulse and v1. this scheme allows electronic variation of the exposure time by a variation in the clock timing while maintaining a standard video frame rate. application of the large shutter pulse must be avoided during the horizontal register readout or an image artifact will appear due to feedthrough. the shutter pulse ves must be ?hidden? in the horizontal retrace interval. the integration time is chan ged by skipping the shutter pulse from one horizontal retrace interval to another. the smear specification is not met under electronic shutter operation. under constant light intensity and spot size, if the electronic exposure time is decreased, the smear signal will remain the same while the image signal will decrease linearly with exposure. smear is quoted as a percentage of the image signal and so the percent smear will increase by the same factor that the integration time has decreased. this effect is basic to interline devices. color filter array (optional, for kai- 1011-cba only) output b g g g g g g r b b b 2 black lines 6 black columns r g r g r figure 4 cfa pattern ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p9
physical description pin description and device orientation gnd 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 v1l v2l sub gnd fdg vdd vouta vrd voutb vss r h2 idhb idha gnd gnd h1b gnd h1a gnd well v2r v1r pixel 1,1 figure 5: pinout diagram pin name description notes 1,5,14,16,20,21 gnd ground 1 2, 24 ?v1 vertical ccd clock - phase 1 2 3, 23 ?v2 vertical ccd clock - phase 2 3 4 sub substrate 6 fdg fast dump gate 7 vdd output amplifier supply 8 vouta video output channel a 9 vss output amplifier return & og 10 ?r reset clock 11 vrd reset drain 12 voutb video output channel b 13 ?h2 a & b horizontal ccd clock - phase 2 15 ?h1b b horizontal ccd clock - phase 1 17 ?h1a a horizontal ccd clock - phase 1 18 idhb input diode b horizontal ccd 19 idha input diode a horizontal ccd 22 well p-well notes: 1. all gnd pins should be connected to well (p-well). 2. pins 2 and 24 must be connected together - only 1 phase 1 clock driver is required. 3. pins 3 and 23 must be connected together - only 1 phase 2 clock driver is required. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p10
imaging performance all the following values were derived using nominal oper ating conditions using the recommended timing. unless otherwise stated, readout time = 140ms, integr ation time = 140ms and sensor temperature = 40 c. correlated double sampling of the output is assumed and recommended. many units are expressed in electrons, to convert to voltage, multiply by the amplifier sensitivity. defects are excluded from the following tests and the signal output is referenced to the dark pi xels at the end of each line unless otherwise specified. electro-optical for kai-1011-cba symbol parameter min. nom. max. units notes f f optical fill factor 55.0 % e sat saturation exposure 0.046 j/cm 2 1 qe r red peak quantum efficiency = 620nm 25 % 2 qe g green peak quantum efficiency = 530nm 28 % 2 qe b blue peak quantum efficiency = 470nm 34 % 2 r gs green photoresponse shading 6 % 4 prnu photoresponse non-uniformity 15.0 %pp 3, 6 prnl photoresponse non-linearity 5.0 % amplifier sensitivity 11.5 v/e - table 1 electro-optical image specifications kai-1011-cba notes: 1. for = 530nm wavelength, and vsat = 350mv. 2. refer to typical values from figure 6 nominal kai-1011-cba spectral response . 3. under uniform illumination with output signal equal to 280 mv. 4. this is the global variation in chip outp ut for green pixels across the entire chip. 5. it is recommended to use low pass filter with cut-off at ~ 680nm for high performance. 6. per color. units: % peak to peak. a 200 by 200 sub roi is used. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p11
0% 5% 10% 15% 20% 25% 30% 35% 40% 400 450 500 550 600 650 700 750 800 850 900 950 1000 wavelength (nm) quantum efficiency (%) red green blue figure 6 nominal kai-1011-cba spectral response ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p12
electro-optical for kai-1010-aba symbol parameter min. nom. max. units notes f f optical fill factor 55.0 % e sat saturation exposure 0.037 j/cm 2 1 qe peak quantum efficiency 37 % 2 prnu photoresponse non-uniformity 10.0 %pp 3, 4 prnl photoresponse non-linearity 5.0 % table 2 electro-optical image specifications kai-1010-aba notes: 1. for = 550nm wavelength, and vsat = 350mv. 2. refer to typical values from figure 7 nominal kai-1010-aba spectral response . 3. under uniform illumination with output signal equal to 280 mv. 4. units: % peak to peak. a 200 by 200 sub roi is used. 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 400 450 500 550 600 650 700 750 800 850 900 950 1000 wavelength (nm) absolute quantum efficiency figure 7 nominal kai-1010-aba spectral response ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p13
0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 angle from normal incidence (degrees) quantum efficiency (percent relative to normal incidence) vertical horizontal figure 8 angular dependence of quantum efficiency for the curve marked ?horizontal?, the incident ligh t angle is varied in a plane parallel to the hccd. for the curve marked ?vertical?, the incident light angle is varied in a plan e parallel to the vccd. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p14
kai-1010 frame rate versus horizontal clock frequency 0 10 20 30 40 50 60 0 5 10 15 20 25 30 35 40 horizontal clock frequency - (mhz) frame rate (frames per second) single channel dual channel dual channel es t ima t e d single channel es t ima t e d figure 9 frame rate versus horizontal clock frequency ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p15
ccd image specifications symbol parameter min. nom. max. units notes vsat output saturation voltage 350 mv 1,2,8 i d dark current 0.5 na dcdt dark current doubling temp 7 8 10 c cte charge transfer efficiency 0.99999 2,3 f h horizontal ccd frequency 40 mhz 4 il image lag 100 e - 5 xab blooming margin 100 6,8 smr vertical smear 0.01 % 7 table 3 ccd image specifications notes: 1. vsat is the green pixel mean value at saturation as measured at the output of the device with xab=1. vsat can be varied by adjusting vsub. 2. measured at sensor output. 3. with stray output load capacitance of c l = 10 pf between the output and ac ground. 4. using maximum ccd frequency and/or minimum ccd transfer times may compromise performance. 5. this is the first field decay lag measured by strobe illuminating the device at (hsat,vsat), and by then measuring the subsequent frame's average pixel output in the dark. 6. xab represents the increase above th e saturation-irradiance leve l (hsat) that the device can be exposed to before blooming of the vertical shift register will occur. it should also be noted that vout rises above vsat for irradiance levels above hsat, as shown in figure 10 . 7. measured under 10% (~ 100 lines) image height illumina tion with white light source and without electronic shutter operation and below vsat. 8. it should be noted that there is trade off between xab and vsat. output amplifier @ vdd = 15v, vss = 0.0v symbol parameter min. nom. max. units notes vodc output dc offset 7 v 1,2 pd power dissipation ---- 225 ---- mw 3 f- 3db output amplifier bandwidth 140 mhz 1,4 cl off-chip load 10 pf table 4 output amplifier image specifications notes: 1. measured at sensor output wi th constant current load of i out = 5ma per output. 2. measured with vrd = 9v during th e floating-diffusion reset interval, ( r high), at the sensor output terminals. 3. both channels. 4. with stray output load capacitance of c l = 10 pf between the output and ac ground. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p16
general symbol parameter min. nom. max. units notes vn - total total sensor noise 0.5 mv, rms 1 dr dynamic range 60 db 2 table 5 general image specifications notes: 1. includes amplifier noise and dark cu rrent shot noise at data rates of 10mhz. the number is based on the full bandwidth of the amplifier. it can be re duced when a low pass filter is used. 2. uses 20log(vsat/vn - total) where vsat refers to the output saturation signal. 0 50 100 150 200 250 300 350 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 sensor plane irradiance - h - (arb) output signal - vout - (mv) (hsat, vsat) figure 10 typical kai-1010-aba photoresponse ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p17
0 100 200 300 400 500 600 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 sensor plane irradiance - h - (arb) output signal - vout - (mv) vsub=8v vsub=9v vsub=10v vsub=11v vsub=12v vsub=13v vsub=14v vsub=15v figure 11 example of vsat versus vsub as vsub is decreased, vsat increases and anti-blooming protection decreases. as vsub is increased, vsat decrease s and anti-blooming protection increases. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p18
defect classification all values derived under nominal operating conditions at 40 o c operating temperature. defect type defect definition number allowed notes defective pixel under uniform illumination with mean pixel output at 80% of vsat, a defective pixel deviates by more than 15% from the mean value of all pixels in its section. 12 1,2 bright defect under dark field conditions, a bright defect deviates more than 15mv from the mean value of all pixels in its section. 5 1,2 cluster defect two or more vertically or horizontally adjacent defective pixels. 0 2 notes: 1. sections are 252 (h) x 255 (v) pixel groups, which divi de the imager into sixteen equal areas as shown below. 2. for the color device, kai-1010-cba, a defective pixel deviat es by more than 15% from th e mean value of all active pixels in its section with the same color 1,1 1008,1018 1008,1 1,1 252,1 504,1 1,255 1,510 1,1018 1,1018 252,1018 504,1018 1008,1018 1008,255 1008,510 1008,1 756,1 756,1018 1,765 1008,765 test conditions junction temperature (t j ) = 40 o c integration time (t int ) = 70msec readout rate (t readout ) = 70msec ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p19
operation absolute maximum range rating description min. max. units notes temperature (@ 10% 5%rh) operation without damage -50 +70 c 5, 6 sub-well 0 +40 v 1 vrd,vdd,og&vss-well 0 +15 v 2 idha,b & vouta,b - well 0 +15 v 2 v1 - v2 -12 +20 v 2 h1a, h1b - h2 -12 +15 v 2 h1a, h1b, h2, fdg - v2 -12 +15 v 2 h2 - og & vss -12 +15 v 2 r ? sub -20 0 v 1,2,4 voltage (between pins) all clocks - well -12 +15 v 2 current output bias current (i out ) ---- 10 ma 3 table 6 absolute maximum ranges notes: 1. under normal operating conditions the substrate voltag e should be above +7v, but may be pulsed to 40 v for electronic shuttering. 2. care must be taken in handling so as not to create static discharge which may permanently damage the device. 3. per output. i out affects the band-width of the outputs. 4. r should never be more positive than vsub. 5. the tolerance on all relative humidity values is provid ed due to limitations in meas urement instrument accuracy. 6. the image sensor shall continue to function but not n ecessarily meet the specifications of this document while operating at the specified conditions. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p20
dc operating conditions symbol description min. nom. max. units pin impedance 6 notes vrd reset drain 8.5 9 9.5 v 5pf, > 1.2m ird reset drain current 0.2 ma vss output amplifier return & og 0 v 30pf, >1.2m iss output amplifier return current 5 ma vdd output amplifier supply 12 15.0 15.0 v 30pf, >1.2m iout output bias current 5 10 ma 5 well p-well ---- 0.0 ---- v common 1 gnd ground ----- 0.0 ---- v 1 fdg fast dump gate -7.0 -6.0 -5.5 v 20pf, >1.2m 2 sub substrate 7 vsub 15 v 1nf, >1.2m 3 idha, idhb input diode a, b horizontal ccd 12.0 15.0 15.0 v 5pf, > 1.2m 4 table 7 dc operating conditions notes: 1. the well and gnd pins should be connected to p-well ground. 2. the voltage level specified will disable the fast dump feature. 3. this pin may be pulsed to ves=40v for electronic shuttering 4. electrical injection test pins. connect to vdd power supply. 5. per output. note also that i out affects the bandwidth of the outputs. 6. pins shown with impedances greater than 1.2 mohm are ex pected resistances. these pins are only verified to 1.2 mohm. 7. the operating levels are for room temperature operation. operation at other temperatures may or may not require adjustments of these voltages. +15v 0.1 f vout 5ma 140 1 k buffered output 2n3904 or equivalent figure 12 recommended output structure load diagram ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p21
ac clock level conditions symbol description level min. nom. max. units pin impedance 2 low -10.0 -9.5 -9.0 v mid 0.0 0.2 0.4 v v1 vertical ccd clock high 8.5 9.0 9.5 v 25nf, >1.2m low -10.0 -9.5 -9.0 v v2 vertical ccd clock high 0.0 0.2 0.4 v 25nf, >1.2m low -7.5 -7.0 -6.5 v h1a 1 horizontal ccd a clock high 2.5 3.0 3.5 v 100pf, > 1.2m low -7.5 -7.0 -6.5 v h1b 4 1 horizontal ccd b clock (single register mode) 100pf, > 1.2m low -7.5 -7.0 -6.5 v h1b 4 1 horizontal ccd b clock (dual register mode) high 2.5 3.0 3.5 v 100pf, > 1.2m low -7.5 -7.0 -6.5 v h2 2 horizontal ccd clock high 2.5 3.0 3.5 v 125pf, > 1.2m low -6.5 -6.0 -5.5 v r reset clock high -0.5 0.0 0.5 v 5pf, > 1.2m low -7.0 -6.0 -5.5 v fdg 3 fast dump gate clock high 4.5 5.0 5.5 v 20pf, > 1.2m table 8 ac clock level conditions notes: 1. the ac and dc operating levels are for room temperature operation. operation at other temperatures may or may not require adjustments of these voltages. 2. pins shown with impedances greater than 1.2 mohm are expected resistances. these pins are only verified to 1.2 mohm. 3. when not used, refer to dc operating condition. 4. for single register mode, set h1b to -7.0 volts at all times rather than clocking it. this device is suitable for a wide range of applications re quiring a variety of different operating conditions. consult eastman kodak in those situations in which operating conditions meet or exceed minimum or maximum levels. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p22
ac timing requirements for 20 mhz operation symbol description min nom max units notes figure t r reset pulse width 10 nsec figure 10 t es electronic shutter pulse width 10 25 sec figure 11 t int integration time 0.1 msec 1 figure 11 t vh photodiode to vccd transfer pulse width 4 5 sec 2 figure 8 t cd clamp delay 15 nsec figure 10 t cp clamp pulse width 15 nsec figure 10 t sd sample delay 35 nsec figure 10 t sp sample pulse width 15 nsec figure 10 t rd vertical readout delay 10 ---- ---- sec figure 8 t v v1, v2 pulse width 3 ---- sec figure 9 t h clock frequency h1a, h1b , h2 ---- 20 mhz figure 10 t ab line a to line b transfer pulse width 3 sec figure 13 t hd horizontal delay 3 sec figure 9 t vd vertical delay 25 nsec figure 9 t hves horizontal delay with electronic shutter 1 sec figure 11 table 9 ac timing requirements for 20 mhz operation notes: 1. integration time varies with shutter speed. it is to be noted that smear increases when integration time decreases below readout time (frame time). photodiode dark current increases when integration time increases, while ccd dark current increases with read out time (frame time). 2. antiblooming function is off du ring photodiode to vccd transfer. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p23
frame timing - single register readout v1 v1 v2 v2 0 0 1 1 2 2 3 4 1023 1023 1022 1022 1021 1020 1019 1018 t vh t rd 1023 1022 1021 0 1 frame = 1024 lines fra m e ti m e figure 13 frame timing - single register readout note: when no electronic shutter is used, the in tegration time is equal to the frame time. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p24
line timing - single register readout ?2 r h1b he ld low for sing le reg ister o p era tion v1 t v ?1 v2 t d ? t vd ?1 line content 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 21 22 1012 1013 1014 1015 1016 1017 1018 1019 1020 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 empty shift register phases dark reference pixels photoactive pixels figure 14 line timing - single register output ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p25
pixel timing - single register readout si g n a l si g n a l re f e re n c e re f e re n c e tsp tc p tc d tsd h1 a h2 vo ut a clamp sam ple vid eo after do uble correlated sampling (inverted) r tr th=50ns min 1 count = 1 pixel figure 15 pixel timing diagra m - single register readout ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p26
electronic shutter timing - single register readout v1 v1 v2 v2 h1 a h2 ves (sub) integration time tint ves (sub) ves (sub) re f e r e n c e vsu b ve s t es t hves electronic shutter - operating voltages electronic shutter - placement electronic shutter - frame timing figure 16 electronic shutter timing diagram - single register readout ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p27
frame timing - dual register readout v1 v2 0,1 0,1 2,3 2,3 4,5 4,5 6,7 8,9 1022,1023 1022,1023 1020,1021 1020,1021 1018,1019 1016,1017 1014,1015 1012,1013 1 frame = 512 lines pairs fra m e ti m e v1 v2 0,1 1022,1023 1020,1021 1018,1019 trd tvh figure 17 frame timing - dual register readout note: when no electronic shutter is used, the in tegration time is equal to the frame time. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p28
line timing - dual register readout ?2 r v1 t v t v t v ?1 v2 t d ? t vd t ?/ ?1 line content 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 21 22 1012 1013 1014 1015 1016 1017 1018 1019 1020 1021 1022 1023 1024 1025 1026 1027 1028 1029 1030 1031 empty shift register phases dark reference pixels photoactive pixels figure 18 line timing - dual register output ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p29
pixel timing - dual register readout si g n a l si g n a l re f e re n c e re f e re n c e tsp tc p tc d tsd h1 b h1 a h2 vo ut a clamp sam ple vid eo after do uble correlated sampling (inverted) r tr th=50ns min 1 c ount = 1 pixel figure 19 figure pixel timing diagram - dual register readout ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p30
fast dump timing ? removing four lines v1 v2 fdg h1a h2 r dumped line #1 dumped line #2 dumped line #3 dumped line #4 valid line end of a valid line valid line min 0.5 sec v2 fdg min 0.5 sec v2 fdg max 0.1 sec fdg v2 fast dump rising edge wrt v2 falling edge fast dump falling ed ge wrt v2 falling edge fast dump falling edge wrt v2 rising edge h1b figure 20 fast dump timing - removing four lines ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p31
binning ? two to one line binning v1 h1a r v2 h2 t v t vd t hd h1b figure 21 binning - 2 to 1 line binning ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p32
timing ? sample video waveform figure 22 sample video waveform at 5mhz ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p33
storage and handling climatic requirements item description min. max. units conditions notes temperature -25 +40 o c @ 10% 5% rh 1, 2 operation to specification humidity 10 86 %rh @ 36 2 o c temp. 1, 2 temperature -55 +70 o c @ 10% 5%rh 2, 3 storage humidity ----- 95 %rh @ 49 2 o c temp. 2, 3 table 10 climatic requirements notes: 1. the image sensor shall meet the specifications of this document while oper ating at these conditions. 2. the tolerance on all relati ve humidity values is provided due to limitations in measurement instrument accuracy. 3. the image sensor shall meet the specifications of this do cument after storage for 15 days at the specified condition esd 1. this device contains limited protection against electrostatic discharge (esd). ccd image sensors can be damaged by electrostatic discharge. failure to do so may alter device pe rformance and reliability. 2. devices should be handled in accordance with strict esd procedures for class 0 (<250v per jesd22 human body model test), or class a (<200v jesd22 machine model test) devices. devices are shipped in static-safe containers and should only be handled at static-safe workstations. 3. see application note mtd/ps-0224 ?electrostatic discharge control for image sensors? for proper handling and grounding procedures. this application note also contains reco mmendations for workplace modifications for the minimi zation of electrostatic discharge. 4. store devices in containers made of electro- conductive materials. cover glass care and cleanliness 1. the cover glass is highly susceptible to particles and other contamination. perform all assembly operations in a clean environment. 2. touching the cover glass must be avoided 3. improper cleaning of the cover glass may damage these devices. refer to application note mtd/ps- 0237 ?cover glass cleaning for image sensors? environmental exposure 1. do not expose to strong sun light for long periods of time. the color filters and/or microlenses may become discolored. long time exposures to a static high contrast scene should be avoided. the image sensor may become discolored and localized changes in response may occur from color filter/microlens aging. 2. exposure to temperatures exceeding the absolute maximum levels should be avoided for storage and operation. failure to do so may alter device performance and reliability. 3. avoid sudden temperature changes. 4. exposure to excessive humidity will affect device characteristics and should be avoided. failure to do so may alter device performance and reliability. 5. avoid storage of the product in the presence of dust or corrosive agents or gases. long-term storage should be avoided. deterioration of lead solderability may occur. it is advised that the solderability of the device lead s be re-inspected after an extended period of storage, over one year ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p34
mechanical information completed assembly figure 23: completed assembly (1 of 2) notes: cover glass is manually placed and visually aligned over die ? location accuracy is not guaranteed. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p35
figure 24: completed assembly (2 of 2) notes: 1. center of image area is offset from cente r of package by (-0.02, -0.06) mm nominal. 2. die is aligned within +/- 2 degree of any package cavity edge. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p36
cover glass figure 25: glass drawing ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p37
quality assurance and reliability quality strategy all image sensors will conform to the specifications stated in this document. this will be accomplished through a combination of statistical process control and inspection at key points of the production process. typical specification limits are not guaranteed but provided as a design target. for further information refer to iss application note mtd/ps-0292, quality and reliability. replacement all devices are warranted agai nst failure in accordance with the terms of terms of sale. this does not include failure due to mechanical an d electrical causes defined as the liability of th e customer below. liability of the supplier a reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the customer. liability of the customer damage from mechanical (s cratches or breakage), electrostatic discharge (esd) damage, or other electrical misuse of the device beyond the stated absolute maximum ratings, which occurred after receipt of the sensor by the customer, shall be the responsibility of the customer. reliability information concerning the quality assurance and reliability testing procedures and results are available from the image sensor solutions and can be supplied upon request. for further information refer to iss application note mtd/ps-0292, quality and reliability. test data retention image sensors shall have an identifying number traceable to a test data file. test data shall be kept for a period of 2 years after date of delivery. mechanical the device assembly drawing is provided as a reference. the device will conform to the published package tolerances. kodak reserves the right to change any in formation contained herein without notice. all information furnished by kodak is believed to be accurate. life support applications policy kodak image sensors are not authorized for and should not be used within life support systems without the specific written consent of the eastman kodak comp any. product warranty is limited to replacement of defective components and does not cover injury or property or other consequential damages. ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p38
revision changes revision number description of revision 0.0 revision 0 is the original version of the document 1.0 revision 1.0 changes name from kai-1001c to kai-1001 series and in cludes data on all series imagers 2.0 entire spec revised 3.0 entire spec revised 4.0 changed from kai-1001 series to kai-1010. added cluster closeness specification, 4 good pixels between cluster defects. 5.0 changed defect and grades. added frame rate table and angle qe. 6.0 added web and e-mail references to footers. added pixel 1,1 locator to figure 7, pinout diagram. corrected missing reference to figure 16 in electro-optical for kai-1010cm note 2. removed reference to kai-1001 from both color and mono qe curves. removed boxes around vertical and hori zontal labels on angle qe figure. removed boxes around labels on frame rate figure, added arro ws from labels to curves. corrected figure 21 vsat versus vsub plot to properly position labels. added web and e-mail references in section 4.3 ordering information. corrected repeat table 4 entry. corrected frame rate versus horizontal clock freq uency figure. data for dual mode was incorrect. 7.0 changed figure 6 label from device drawing #6 di e placement to device drawing ? die placement. added figure 16, fast dump timing. added figure 17, binning ? 2 to 1 line binning. added figure 18, sample video waveform at 5mhz. in appendix 1, part numbers, changed refere nces from taped on glass to snap-on lid. 8.0 updated page layout. color version of part updated to us e improved material. naming of colo r part changed from kai-1010cm to kai-1011cm. page 13 ? added cautions pertai ning to esd and glass cleaning. page 26 ? color prnu value changed from 5 to 15. units clarified to % peak to peak. page 28 ? monochrome prnu value changed from 5 to 10. units clarified to % peak to peak. page 27 ? updated color quantum ef ficiency graph to new kai-1011cm. page 35 ? updated quality assu rance and reliability section. page 36 ? appendix 1 replaced wi th available part configurations. 9.0 page 8 ? figure 5 ? cfa pattern ? corrected pattern. firs t active line is blue/green. previous versions on the specification incorrectly had the first active line as green/red. note: the color filter pattern has not be en physically changed on the device. page 35 ? update storage and handling section. page 36 ? updated quality assu rance and reliability section. 10.0 page 37 ? removed kai-1010 monochrome sealed quartz glass configuration. this configuration has been obsoleted. 11.0 updated format updated summary specification updated completed assembly drawing added cover glass drawing updated ordering information ?eastman kodak company, 2006 www.kodak.com/ go/imagers revision 11 mtd/ps-0502 p39
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?eastman kodak company, 20 06 . kodak and pixelux are trademarks.

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